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A room temperature, laser-based wafer detachment device compatible with wafer sizes up to 300mm.
■ This is a wafer detachment device necessary for the transport/process of thin wafers. ■ It supports various wafer sizes up to 300mm, using room temperature and laser-based wafer detachment.
Adopting solid UV lasers as the light source! Compatible with everything from compact, low-cost LLO devices to large equipment for G6 panels.
The "LSL-100F/VOLCANO LB750-4" is a device that peels off polymer films such as polyimide coated on glass substrates using a laser. By adopting a line beam optical system, it enables a high-quality and high-speed LLO process. The use of solid UV lasers as the light source achieves significant cost reduction. Additionally, it accommodates a range of devices from compact, low-cost LLO systems to large systems for G6 panels. 【Features】 ■ High-quality and high-speed LLO process enabled by adopting a line beam optical system ■ Solid UV lasers used as the light source ■ Significant cost reduction achieved ■ Compatible with both compact, low-cost LLO systems and large systems for G6 panels * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
Customizable," "Free sample processing," "Equipped with in-house developed oscillator," "After-sales service available in Japan.
By using two parts feeders to directly supply the workpieces to the fixture and performing high-precision positioning with a CCD, we achieve fine processing of the inductor surface by simultaneously using three lasers, thereby meeting customer processing requirements. We ensure high stability and prompt after-service response. 【Product Features】 ■ High Precision: Achieves a peeling accuracy within ±0.05mm. ■ High Efficiency: By using three lasers simultaneously, processing of over 2,000 PCS/H is possible. ■ Proprietary Laser Light Source: Adopts customizable fiber lasers, providing optimal cost performance. Additionally, we offer quick and convenient after-service. ■ In-house Developed Marking Board: We develop and provide dedicated marking boards that meet customer customization needs. *For more details, please refer to the PDF document or feel free to contact us.
Customizable," "Free sample processing," "Equipped with in-house developed oscillator," "After-sales service available in Japan.
By using a parts feeder to directly supply the workpiece to the fixture and performing high-precision positioning with a CCD, we achieve fine processing of the inductor surface by simultaneously using two lasers, thereby meeting customer processing requirements. 【Product Features】 ■ High-speed work upload: The upload speed of the workpiece exceeds 18,000 PCS/H. ■ High precision: The laser stripping accuracy for inductors is within ±0.05mm. ■ High efficiency: By using double lasers simultaneously, processing of over 21,000 PCS/H is possible. ■ Proprietary developed laser light source: Utilizing customizable fiber lasers to provide optimal cost performance, along with fast and convenient after-sales service. ■ In-house developed marking board: We develop and provide dedicated marking boards to meet customer customization needs. *For more details, please refer to the PDF document or feel free to contact us.
